Business introduction

  • Hampoo has ten years of professional design experience, complete flow system, and perfect technical support business
  • Support mainstream design tools in the industry: Allegro,Pads,and Mentor Expedition
  • Design type: high-speed, analog, analog-digital mixed, high-density, high-voltage, high-power, RF, back plate, ATE, flexible board, rigid-flexible board, and aluminum substrate, etc.
  • Meet customers' requirements in design, progress, cost, materials, production technology, limitation, reliability, and safety, etc.
  • Hampoo take the lead in the high-speed design and have profound research and technical accumulation on high-speed material.
  • Hampoo has complete DFX simulation system and take a full consideration in production problems at the early design stage
Design capability

Design capability Designed value
Number of maximum design layers 40 layers
Number of maximum PINs 60000
Minimum BGA space 0.4mm
Line width/line distance 2mil/2mil(HDI)
High-speed differential pair design 2009 10Gbps,76cm
2012 14Gbps,100cm
2013 28Gbps,10.6cm
Delivery capability

Number of PINs for a single board Delivery time of design(work day)
0-1000 3-5
2000-3000 5-7
4000-5000 8-12
6000-7000 12-15
8000-9000 15-18
10000-13000 18-20
14000-15000 20-22
16000-20000 22-30
Ultimate delivery capacity 10,000pin/6days
Technical Support
SI
Hampoo has a perfect simulation design flow and solutions on SI problems. Based on SI design and timing requirements, signal integrity simulation before routing can help designers choose components and parts, adjust component and parts placement, plan system clock network and confirm termipoint strategy and topology structure of key networks. Simulation after routing can be used to evaluate if the reflection, ringing, over swing, crosstalk, timing and other parameters of routing match design requirements, so as to help them find potential SI problems and improve design reliability.
PI
With rich experiences in the design of large current power network and in combination with the existing simulation means, Hampoo can discover preliminary risks in design at the early design stage, optimize layouts of parts and power module, copper sheet quantity, and capacitor distribution, etc., so as to ensure the reliability of power network.
EMC
EMC and reliability are playing an increasingly important role in life cycles of electronic products. Since electronic products produce electromagnetic interference or radiation on other electronic products during use and suffer electromagnetic interference from other electronic products, this is not only related to the reliability and safety of electronic products, but also affects the normal running of other electromagnetic interference, even leads to safety dangers. As a key to the market, abundant EMC rules were made by Hampoo, eradicating any potential problems at the early design stage.
DFM
Processes related to production have been considered since product planning and project approval, with the deliberation of product uses and other factors, boards, components and parts, and structures, etc. are optimally selected in consideration of their costs, efficiency, and quality, etc., especially Layout with one board shall abide by the selection. In addition, comprehensive check and amendment on boards shall be conducted with various kinds of simulation software during design so as to ensure first yield rate from design to production and significantly improve DFM, saving time, materials, and cost.

The method with DFM philosophy can effectively reduce trial production times and speed up R&D cycle.The key to the success of PCB Design trial production is taking more problems in consideration during preliminary design.